Dynamic atomizer on conditioner assemblies using high velocity water

ABSTRACT

A conditioner assembly is disclosed for conditioning a polishing pad used in chemical mechanical polishing of planar semiconductor wafer components. One embodiment of the conditioner assembly comprises a plate-type conditioner plate comprising a circular edge, having a first side and a second side, where on the first side is provided one or more diamond-impregnated abrasive elements, each comprising an abrasive surface disposed a distance from said first side comprising diamond particles, and one or more jets oriented to discharge fluid away from said first side. In operation the jets dispense high velocity fluid that hits the surface of the adjacent polishing pad with sufficient force to dislodge diamond particles that have loosened or broken off from the diamond-impregnated abrasive elements, thereby avoiding the embedding of such particles into the polishing pad surface. Another embodiment uses a ring-type conditioner plate assembly instead of a plate type, and also comprises one or more diamond-impregnated abrasive elements, each comprising an abrasive surface disposed a distance from said first side comprising diamond particles, and one or more jets oriented to discharge fluid away from said first side.

FIELD OF THE INVENTION

The present invention is directed to integrated circuit manufacturegenerally, and more specifically to abrading and renewing a polishingpad using a conditioning assembly comprising a forced-fluidparticle-flushing feature.

BACKGROUND OF THE INVENTION

In semiconductor manufacture, semiconductor wafers need to be processedto be flat both initially and at various stages of manufacture. Asdevice features become smaller and smaller, as in the submicron sizerange, and as such features have increasingly tight tolerances, theimportance of achieving a desired level of flatness increases. Withoutattaining a desired level of flatness, other efforts toward obtainingconsistent functionality in submicron size chips tend to falter.Further, in achieving such desired level of flatness, it is important tonot impart any undesirable characteristic to the wafer.

Toward achieving consistently flat wafers, specific apparatuses andmethods related to the process of chemical mechanical planarization(CMP) have been developed. CMP, which combines chemical etching andmechanical abrasion to produce a flat surface, is used in waferpreparation and in wafer fabrication. A polishing pad is used duringCMP. In a typical CMP operation, this pad is placed in abrading contactwith a semiconductor wafer surface, and a slurry is applied. The slurrytypically contains a polishing agent, for instance alumina or silica,and other chemicals that etch or oxidize the wafer surface. Through suchabrading contact, including with application of a slurry, the wafersurface is effectively polished and made more planar.

The typical polishing pad, comprised of material such as polyurethane,is manufactured to have pores or grooves. The pore or groove voids serveto carry the slurry into contact with the wafer surface being abradedand polished. However, particularly for uncoated polishing pads, thesepores become filled with pad material and slurry particles over timeduring the polishing process. This can lead to what is known in the artas pad glazing or pad clogging.

Glazed and/or clogged polishing pads are processed to restore theirfunctionality. This is done after a given period of use of a polishingpad, or upon observation of decreased performance. Typical processinginvolves abrading the polishing pad itself by use of a conditionerassembly. A conditioner assembly generally comprises a circular rigidconditioner body (also referred to as a “plate” or “ring,” or a“dresser”) comprising one or more abrasive elements on one side, and adrive mechanism emanating from a central point on the other side. Duringoperation the drive mechanism positions and provides rotational force toturn the body. Rotation of the conditioner body while the surface of theabrasive elements contact the polishing pad provides a desired removalof accumulated material from the polishing pad surface.

When diamond particles are in the abrasive material, the conditionerbody is known as a diamond conditioner body. Abrasive elements of adiamond conditioner body may be prepared by any of a number of methodsusing all electroplating, all brazing. Other fabrication approachesinclude electroplating in the diamonds, and sifting in powdered metalaround the diamonds, then sintering at high temperature to anchor thediamonds. For instance, in some embodiments of a diamond conditionerbody, an abrasive material is comprised of diamonds embedded in a nickelplating (i.e., diamond-impregnated nickel). As to shapes, in someembodiments a single abrasive element is an annular ring with its outeredge along the periphery of a circular conditioner plate or ring. Inother embodiments there are breaks, or channels, formed between discreteabrasive elements that are similarly arranged with their outer edgesalong the periphery of a circular conditioner plate or ring.

In use, the surface of the abrasive material is pressed against thepolishing pad in a manner to achieve an abrasion to restore thepolishing pad surface. This restoration involves returning the polishingpad surface to a roughened but planar state in which new cleandepressions, such as pores or grooves, are exposed.

An alternative to a diamond conditioner is a brush conditioner. However,a brush conditioner provides a lower removal rate, increasing the timeto condition. Gas blowing and liquid rinsing are other techniquesemployed to remove materials that have become entrapped in the polishingpad.

Also known in the art is a fluid-based in-situ conditioning system, asdescribed in U.S. Pat. No. 6,517,416 B1 (issued Feb. 11, 2003 toCrevasse et al.). Also known in the art are various apparatuses, methodsand compositions are to increase the effectiveness of conditioning apolishing pad, and/or decrease the time to do this. For instance, thefollowing references disclose apparatuses, methods and compositions inthis field: U.S. Pat. No. 6,234,868 B1 (issued May 22, 2001 to Easter etal.); U.S. Pat. No. 6,524,523 (issued Feb. 25, 2003 to Jeng et al.); andU.S. Pat. No. 6,679,761 B1 (issued Jan. 20, 2004 to Sunahara et al.).These references, and all other references cited herein, whetherpatents, patent application publications, scientific or technicalpublications, or other publications, are hereby incorporated byreference for their teachings. As indicated below where appropriate,certain references are incorporated with particularity for indicatedteachings.

Although use of diamond conditioner bodies offer advantages, a problemwith such use has been recognized by the inventors. Whereas it was knownthat during abrasion that a dust is formed that requires removal, it waspreviously unknown that diamond particles may loosen and break off fromthe surface of the abrasive material. Once free on the surface of thepolishing pad, these particles may become embedded in the polishing pad,such as due to the action and pressure of the conditioner assembly. Whenembedded, the diamond can cause diamond scratching on one or more wafersduring subsequent polishing by the so-conditioned polishing pad.Ultimately, during a subsequent conditioning of the polishing pad, theembedded diamond may be removed, but not before having caused waferdamage.

As disclosed and claimed herein, the present invention providesapparatuses and methods directed to reduce and/or eliminate theoccurrence of, and/or dislodge undesired embedded diamonds in apolishing pad during conditioning with a diamond conditioner assembly.This solves the identified problem, and improves the performance ofconditioned polishing pads, and decreases the defect rate ofsemiconductor wafers polished by such pads.

SUMMARY OF THE INVENTION

In one embodiment of the present invention, a conditioner assembly iscomprised of one or more jets that direct a flow of high velocity fluid,such as water, onto the surface of the polishing pad. Typically, thejets are positioned within a boundary formed by the interior border ofthe diamond-impregnated abrasive material of the conditioner body. Theshape of this diamond-impregnated abrasive material, that is formed inor attached to the conditioner body, may be selected from: an annularring; an annular ring broken by radially oriented channels; or othershapes and configurations as known in the art.

The one or more jets are adapted to deliver high velocity fluid, such aswater, during a conditioning process. The high velocity fluid washesaway diamond particles that may have loosened or broken off from theconditioner plate abrasive surface prior to becoming embedded in thepolishing pad. A driving arm around which the conditioner body rotatesis attached to the conditioner body, such as at its center, to providefor rotation of the conditioner body including the associated abrasivematerial. Fluid communication is provided between a fluid supply and theone or more jets wherein that fluid communication is maintainable duringthe rotation, such as by use of a rotary union.

In another embodiment of the present invention, a method of conditioninga polishing pad is comprised of contacting a conditioner body (i.e., itsabrasive material), having components described above, with a polishingpad in need of polishing, effecting relative rotation between theconditioner body and the polishing pad, and supplying high velocityfluid during the contacting, wherein the fluid dislodges and/or washesaway diamond particles that have loosened or broken off from theconditioner plate. The fluid also washes away debris and/or dried slurrythat is being acted upon by the abrasive surface on the conditionerplate.

Other aspects, advantages and objects of the present invention areprovided in the following description, which is to be considered withthe appended drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

For a better understanding of the invention, reference is made to thefollowing detailed description taken in conjunction with theaccompanying drawings in which:

FIG. 1A provides a schematic cross-sectional side view of one embodimentof a plate-type conditioner assembly of the present invention having acontinuous annular abrasive element. FIG. 1B provides a schematic topview of the plate-type conditioner body depicted in FIG. 1A.

FIGS. 2A and 2B provide bottom and top views, respectively, of aplate-type conditioner body of the present invention. FIG. 2C provides aclose-up view of one abrasive element disposed on the bottom edge of theplate-type conditioner body.

FIGS. 3A and 3B provide bottom and top views, respectively, of aring-type conditioner body of the present invention. FIG. 3C provides atop view of one embodiment of a drive transfer frame with central shaft.FIG. 3D provides a close-up view of one abrasive element disposed on thebottom edge of the ring-type conditioner body.

DETAILED DESCRIPTION OF THE INVENTION

For the figures described herein, unless otherwise indicated likereference numerals refer to the same or similar structures identified inprevious figures.

As used herein, including the claims, the term “diamonds” and “diamondparticles” are taken to mean the grains, powders, and dusts of diamonds,typically synthetic diamonds. Size-segregated (i.e., sieved) diamondpowders from synthetic diamond sources commonly are used in themanufacture of abrasive elements used on conditioner plates, becausethis source provides greater uniformity. A representative particle sizecategory for diamond particles used in a conditioner plate abrasiveelement is 200 mesh (i.e., particles passing through a mesh having 200holes per linear inch). Smaller and larger sizes of diamond particlesare used, depending on a particular purpose or preference.

As used herein, including the claims, an abrasive element that containsdiamonds is identified as a “diamond-impregnated abrasive element” or,alternatively, as an “abrasive surface formed by a plurality of diamondparticles embedded in the surface.” This comprises diamond particles asdefined above. When a diamond-impregnated abrasive element is associatedwith a conditioner body (i.e., plate-type or ring-type) of the presentinvention, whether formed integrally with or attached thereto, thiscombination is referred to herein variously as a “diamond conditionerbody,” or as a “diamond-type conditioner” or a “diamond conditioner”(the latter two terms optionally including other components of aconditioner assembly). However, in that it is the plate-type orring-type conditioner body that is a standard functional unit in theart, this combination also is referred to as a conditioner body thatcomprises such abrasive element or surface.

As described in the embodiments below, a diamond-impregnated abrasiveelement may be shaped into an annular ring, with or without channels,and into other shapes suitable for the purpose of conditioning apolishing plate that is subsequently used to polish and flattensemiconductor wafers at the start, or during, wafer fabrication. Also asdescribed herein, it is appreciated that a conditioner body of thepresent invention, to which is attached (or which is made integral with)a diamond-impregnated abrasive element, may be of a plate-type or of aring-type or ring shape. A conditioner body of the present invention,when associated with one or more other components for the purpose ofconditioning (such as an apparatus for positioning, etc.), is identifiedas a conditioner assembly.

The diamond-impregnated abrasive element comprises an abrasive surfacethat, during operation of a conditioner assembly, is placed in intimatecontact with a polishing plate to be conditioned. The intimate contactover time has been found to result in the release or break-off ofdiamond particles. The diamond-impregnated abrasive element is formed byany means known in the art, and is formed with or attached to theconditioner body by any means known in the art. Without being limiting,examples of creating and attaching a diamond-impregnated abrasiveelement are taught in U.S. Pat. No. 6,524,523 (to Jeng et al.) which isincorporated by reference with particularity for such teachings,including the discussion of the prior art in that patent, and for thedesigns of conditioner bodies.

FIGS. 1A and 1B provide side cross-sectional and top schematic views ofone embodiment of a plate-type conditioner assembly of the presentinvention. A plate-type conditioner body 100 is disc-shaped (i.e.,comprising a circular edge 101 with substantially flattened opposingsides) and comprises on a bottom side 102 two jets 104. The two jets 104are disposed within a peripherally located annular ring of abrasive 105.To rotate the conditioner body 100, a rotating arm 106 attaches to thetop side 103 of said conditioner body 100. The rotating arm 106 isadapted for connection to a motor (not shown) to drive the conditionerbody 100 in a rotating manner. More generally, any type of rotating armor drive as is known in the art may be employed, such as thoseincorporating rotary unions to supply water to the conditioner body 100.Also, any means for attaching the conditioner body 100 to a rotationaldriving shaft, such as rotating arm 106, may be employed as is known inthe art. For instance, not to be limiting, U.S. Pat. No. 5,899,800 (toShendon) teaches a rotary union associated with a drive shaft (i.e.,rotating arm), and is incorporated by reference particularly for theteachings of a rotary union and of attachment to the conditioner body.

The annular ring of abrasive 105 is attached to or formed with theconditioner body 100, and is one shape of a diamond-impregnated abrasiveelement of the present invention. When not formed with the conditionerbody 100, the annular ring of abrasive 105 is secured to the conditionerbody 100 by means known in the art. The annular ring of abrasive 105 iscomprised of diamonds 107 mixed interspersed in the annular ring ofabrasive 105, which may be otherwise comprised of a metal such asnickel. The annular ring of abrasive 105 and has an exterior edge 108and interior edge 109. In that the annular ring of abrasive 105 has aplanar surface 110 that is disposed below bottom side 102 of conditionerbody 100 interior to interior edge 109, a recess 112 is formed withinthe confines of the annular ring of abrasive 105.

As depicted in FIGS. 1A and 1B, the two jets 104 fluidly communicatewith recess 112. To the other end of each of the two jets 104 is aconnector housing 114, here shown disposed partially within theconditioner body 100. The connector housing 114 receives a connector(not shown) that fluidly connects with a supply of high velocity water(not shown). Intervening fluid connections between the supply and thejets 104 are adapted to provide water during rotation of the conditionerbody 100 by the rotating arm 106, such as by any of various rotaryunions known to those skilled in the art.

Accordingly, during operation, when the annular ring of abrasive 105 ofconditioner 100 is disposed against a surface of polishing pad (notshown), which is to be conditioned thereby, and when the conditioner 100is rotating to create an abrasive action, high velocity water also isflowing from the supply, through the connectors, and through the jets104. The water flow from these jets 104 is directed to the surface ofthe polishing pad (not shown), thereby serving to loosen and/or washaway diamond particles that are, respectively, embedded or lying on thesurface of the polishing pad beneath the flow of water from the jets104. Given the rotating motion of the conditioner 100 about the rotatingarm 106 (and, optionally, given the rotation of the polishing pad and/orthe lateral movement of the conditioner across the polishing pad), theforce of water from the jets 104 moves across a large surface area ofthe polishing pad.

As water from the jets 104 flows into recess 112, it seeks a path ofleast resistance to flow out. From the space defined by recess 112 thewater flows laterally to a lower pressure area, such as that open spaceexternal to the annular ring of abrasive 105. When no breaks, orchannels, in the annular ring of abrasive 105 exist, the water passesacross the active interface of the annular ring of abrasive 105 rotatingacross the surface of the polishing plate. While not being bound to aparticular theory, this is believed to provide additional cleaningaction.

Also, regardless of the existence of breaks or channels in the annularring of abrasive 105, it is noted that the effects of the waterimpacting the polishing pad surface from jets 104 additionally removeand/or wash away debris and/or dried slurry from previous polishprocesses. Thus, one or more of the above interactions and phenomenonresults in better defect performance and reduces or eliminates driedslurry scratches on a wafer later polished by a polishing pad soconditioned.

FIG. 2A provides a perspective view a plate-type conditioner body 200having a circular edge 201, and showing features of the bottom side 202.On the bottom side 202 along the circular edge 201 are disposed abrasiveelements 205 separated by channels 215. Disposed more centrally are twojets 204 that provide high velocity water, as described herein, to flushaway diamond particles.

FIG. 2B provides a perspective view of the top side 203 of theplate-type conditioner body 200 of FIG. 2A. Disposed near the circularedge are holes 212 for attachment of the conditioner body 200 to a drivemechanism (not shown). More centrally located are holes 213 foralternative attachment of a drive mechanism (not shown). Either set ofholes 212 or 213 may be used for attachment of a drive mechanism thatincludes a rotary union (not shown) for supply of water during rotation.Also shown are two holes 216 through which water passes to supply jets204.

FIG. 2C provides a perspective view of one abrasive element 205 of FIG.2A. A plurality of diamond particles 207 are apparent on the abrasiveelement surface 210. The shape of abrasive element 205 also is definedby an exterior edge 208, an interior edge 209, and sides 211. Betweenopposing sides 211 of adjacent abrasive elements 205 are channels 215.

FIG. 3A provides a perspective view a ring-type conditioner body 300having a circular edge 301, and showing features of the bottom side 302of the ring shape. On the bottom side 302 along the circular edge 301are disposed abrasive elements 305 separated by channels 315. A largeopen span 317 exists in the middle of the ring shape.

FIG. 3B provides a perspective view of the top side 303 of the ring-typeconditioner body 300 of FIG. 3A. Disposed near the circular edge areholes 312 for attachment of the conditioner body 300 to a drivemechanism (not shown). More centrally located are larger holes 313 foralternative attachment of a drive mechanism (not shown). Either set ofholes 312 or 313 may be used for attachment of a drive mechanism thatincludes a rotary union (not shown) for supply of water during rotation.Jet braces 319 are attached to the top side of conditioner body 300 tohold jets 304 in desired positions. In other embodiments (not shown),the jets may be positioned directly on drive transfer frame, such as 318in FIG. 3C. Drive transfer frame 318 depicts one embodiment by which adrive shaft 306 attaches to body 300 (not shown) via six arms 330, eachbearing a hole 332 to align with holes 313. Jets may be placed in or onsuch arms 330. Various arrangements for communicating a water supply tojets, and for providing rotational force, will become apparent to thoseskilled in the art.

During operation, as discussed above for other embodiments, the two jets304 provide high velocity water, as described herein, to dislodge and/orflush away diamond particles, as well as other particulates.

FIG. 3D provides a perspective view of abrasive elements 305 of FIG. 3A.A plurality of diamond particles 307 are apparent on the abrasiveelement surface 310. The shape of abrasive element 305 also is definedby an exterior edge 308, an interior edge 309, and sides 311. Betweenopposing sides 311 of adjacent abrasive elements 305 are channels 315.

It is appreciated that one general component of a conditioner assemblyof the present invention is an apparatus for delivering a flow of fluidinto an interface between said conditioner body and said planar surfaceof the polishing pad. Any approaches as known in the art for fluidlycommunicating a supply of fluid to a rotating conditioner body may beemployed, such as the use of a rotary union. As to the outlets for suchfluid, these are generally referred to as “jets,” however appreciatingthat a range of outlets may be used so long as they fulfill thefunctional requirement of supplying high velocity fluid against asurface of a polishing pad that opposes the conditioner body surfacecomprising the abrasive surface. Thus, a simple hole (as shown in FIG.1A) through which water passes may be used as an outlet, or,alternatively, a separate jet nozzle may be attached to such a hole,such as by threading the nozzle into such a hole.

As to the channels 215 and 315 of plate-type conditioner 200 andring-type conditioner 300, respectively, these provide more facileroutes of exit than when water from jets 104 of conditioner 100 mustpass through relatively small spaces between the non-interruptedabrasive surface 105 and the opposing polishing pad surface (not shown),as the latter are intimately contacting during operation. Not beingconstrained by frictional loss as would be higher through such smallspaces, the flow through the channels is more rapid and is suitable tocarry away dislodged diamond particles. As conditioner body 200 or 300rotates, this exposes different surface areas of the polishing pad tosuch washing action. For a dislodged diamond particle (not shown) thatis either lying on or partially embedded in the surface of the polishingpad (not shown), upon exposure to the transient flow of water throughchannels 215 or 315 during rotation, such flow may by its force carryaway or dislodge and carry away such particle. Further, as the effectivevelocity of the water is increased at a distance from the impact area ofthe spray, along the polishing pad, the force increases for carryingaway a diamond particle from that non-impact area. Thus, theoptimization of the angling, positioning and flow rate (at the impactand at non-impact areas) for each outlet, in consideration of the exitpattern, can result in most or all diamond particles being dislodged andremoved with re-lodging into the polishing pad surface.

Also, for any embodiment, the angle of the jet may be angled to deviatefrom 90 degrees relative to the planar surface of the polishing pad. Forexample, not to be limiting, in some embodiments the jet is angledoutwardly (relative to the inward geometric center of the conditionerbody, i.e., the centerline of the drive mechanism). That is, the angleis less than 90 degrees relative to degrees from the plane of said firstside, and oriented toward the circular edge, specifically directed topass fluid through a channel. Such outward angling provides an advantageof propelling at a greater velocity dislodged diamond particles so thatthey have a greater possibility of directly through a rotating channelwithout becoming re-embedded due to action of the rotating abrasiveelement(s). The degree of this directionality is balanced with the lossof some force of impact against the surface, as occurs when the angle is90 degrees from the plane of the polishing pad.

Further as to the location and angling of jets, in certain embodimentsthe jets are positioned near to the interior edges ofdiamond-impregnated abrasive elements, and are angled outward andpositioned so the water spray strikes near or in the space of a channelbetween two adjacent elements. This more directly directs dislodgeddiamonds through the channel. In certain embodiments, a jet is disposedto direct water near or in the space of each of the channels. In otherembodiments, to conserve water flow, only a portion of the channels havea water spray outlet directing water through the channel.

For plate-type conditioner embodiments such as the one depicted in FIGS.2A-C, during operation water flows outward through the channels 215. Forring-type conditioner embodiments such as the one depicted in FIGS.3A-C, the water may flow outward through the channels 315. However,water also may spray up and pass through the open span 317. This will inpart depend on the flow rate and other factors, such as the style ofopening of the jets 304, and their angles relative to the plane of thepolishing pad.

The compositional characteristics and design of the abrasive surface,and the flow rate of the fluid, such as water, may be varied to achievea desired level of cleaning appropriate to a particular polishing padbeing conditioned. Without being limiting, in an illustrative embodimentthe range of total fluid flow rate is about 1 to about 5 liters perminute for a total of two jets. However, it is believed that a totalfluid flow rate of about 1 to about 3 liters per minute for the two jetsis sufficient to achieve the desired objectives of this invention. Theserates are for a conditioner (plate or ring type) having a diameter about10 inches, and provide water velocity and pressure sufficient to achievethe dislodging of diamond particles that are embedded in theconditioning pad. Higher flow rates may be used, depending on theconditions and the priority of conserving fluid consumption (or the costof recycling it). Total flow rates increase or decrease as the size of aplate increases or decreases. Also, total flow rates increase as thetotal number of jets increases, to provide per jet water velocity andpressure sufficient to achieve the dislodging of diamond particles thatare embedded in the conditioning pad.

Methods of operation using the conditioner assemblies of the presentinvention are described as follows. In one embodiment, a method ofconditioning a polishing pad with a diamond-impregnated conditionerassembly comprises the steps of:

-   -   1. contacting a polishing pad surface with a surface of a        diamond-impregnated abrasive element of a diamond conditioner        plate assembly, said diamond conditioner plate assembly        comprising a jet, the jet in fluid communication with a supply        of water or other fluid;    -   2. providing effective rotation of the conditioner plate        assembly with the planar surface of the polishing pad; and    -   3. directing a flow of high velocity water through said jet        against the surface of the polishing pad;    -   wherein said high velocity water carries away diamond particles        loosened from said diamond-impregnated abrasive element during        said contacting.

In another method, in addition to the contacting and supplying describedabove, there is a step of flowing the high velocity water through one ormore channels formed in the diamond-impregnated abrasive element.

Although water is stated to flow through the jets in the examples above,it is appreciated that any fluid may be utilized so long as it issuitable for the purpose of washing away particulate matter, and/ordislodging diamond particles, from the surface of a polishing pad. Also,while it is appreciated that the force of the high pressure water is theprimary force to remove dislodged diamond particles and otherundesirable debris, the high velocity water or other fluid mayadvantageously contain foaming agents, surfactants, cleaners and thelike. Such additions to the water or other fluid aid in the removal,cleaning and reconditioning of the polishing pad. Typically when suchadditives are used, prior to completion of the conditioning, the sourceof high velocity water is changed to provide a rinsing using waterwithout such additives.

In other embodiments of the present invention, the diamond conditionerassembly comprising a jet directing water against a polishing platesurface is provided in conjunction with a polishing apparatus forwafers. An example of a polishing apparatus to which this may becombined is found in U.S. Pat. No. 6,517,416, FIGS. 2A and 2B,incorporated by reference specifically for this teaching. The diamondconditioner plate and its associated abrasive elements are disengagedfrom contact with the polishing plate when the polishing plate ispolishing a wafer. Then, when conditioning is desired, the diamondconditioner plate is engaged so as to contact the polishing pad. Duringsuch contacting a flow of high velocity water passes through the jet(s)of the conditioner plate and serves to flush away any of dislodgeddiamond particles, debris formed from the abrading contacting, and, moreparticularly, dried slurries from a previous polishing process.

While the preferred embodiments of the present invention have been shownand described herein in the present context, such embodiments areprovided by way of example only, and not of limitation. Numerousvariations, changes and substitutions will occur to those of skilled inthe art without departing from the invention herein. For example, thepresent invention need not be limited to best mode disclosed herein,since other applications can equally benefit from the teachings of thepresent invention. Accordingly, it is intended that the invention belimited only by the spirit and scope of the appended claims.

1. A conditioner assembly for conditioning a polishing pad used inchemical mechanical polishing of semiconductor wafer comprising: a. apolishing pad conditioner body comprising an abrasive surface formed bya plurality of diamond particles embedded in the surface; b. anapparatus for positioning said conditioner body in abrasive relationshipwith a planar surface of the polishing pad and for effective rotation ofthe conditioner body with the planar surface of the polishing pad; andc. an apparatus for delivering a flow of fluid into an interface betweensaid conditioner body and said planar surface of the polishing pad;wherein the flow of fluid is sufficient to dislodge diamond particleswhich have become embedded in the planar surface of the polishing pad.2. The conditioner assembly of claim 1 wherein said apparatus fordelivering a flow of fluid is comprised of at least one jet.
 3. Theconditioner assembly of claim 1 wherein said abrasive surface iscomprised of an annular ring.
 4. The conditioner assembly of claim 1wherein said abrasive surface is comprised of a plurality of sectionsseparated by channels.
 5. The conditioner assembly of claim 1 whereinsaid conditioner body is plate-shaped.
 6. The conditioner assembly ofclaim 1 wherein said conditioner body comprises a ring shape andcomprises a central void within said ring shape.
 7. The conditionerassembly of claim 1 wherein said apparatus for delivering a flow offluid is comprised of a plurality of jets, each said jet oriented at anangle less than 90 degrees, to direct fluid through one of saidchannels.
 8. The conditioner assembly of claim 2, apparatus fordelivering a flow of fluid comprises a rotary union adapted forrotation, and a conduit attaching to said rotary union, fluidlycommunicating said at least one jet with a supply of water in fluidcommunication with said rotary union.
 9. A conditioner sub-assemblyemployed in conditioning a polishing pad used in chemical mechanicalpolishing of semiconductor wafer comprising: a. a polishing padconditioner body; b. an abrasive surface formed by a plurality ofdiamond particles embedded in the surface, on one side of saidconditioner body; and c. one or more jets in fixed communication withsaid conditioner body, positioned to deliver a flow of fluid into aninterface between said conditioner body and said planar surface of thepolishing pad, wherein the flow of fluid is sufficient to dislodgediamond particles which have become embedded in the planar surface ofthe polishing pad.
 10. A method of conditioning a polishing pad with adiamond-impregnated conditioner body comprising the steps of: a.contacting said polishing pad with an abrasive surface of saidconditioner body, of a conditioner plate assembly plate comprising: i.said conditioner body comprising said abrasive surface formed by aplurality of diamond particles embedded in the surface; ii. an apparatusfor positioning said conditioner body in abrasive relationship with aplanar surface of the polishing pad and for effective rotation of theconditioner body with the planar surface of the polishing pad; and iii.an apparatus for delivering a flow of fluid into an interface betweensaid conditioner body and said planar surface of the polishing pad; b.effecting relative rotation between said polishing pad and saidconditioner body; and c. supplying high velocity water through saidapparatus for delivering a flow of fluid, directed to the surface ofsaid polishing pad; wherein said high velocity water carries awaydiamond particles loosened from said diamond-impregnated abrasiveelement during said contacting.
 11. The method of claim 10, wherein saiddiamond-impregnated abrasive element additionally comprises at least onechannel communicating between an interior edge and an exterior edge ofsaid diamond-impregnated abrasive element, additionally comprisingflowing said high velocity water through said at least one channel. 12.A method of assuring removal of particulate matter from a surface of apolishing pad during conditioning, comprising the steps of: a.positioning a conditioner body in abrasive relationship with a planarsurface of the polishing pad; b. providing effective rotation of theconditioner body with the planar surface of the polishing pad; and c.supplying high velocity water through said conditioner body fordelivering a flow of fluid, directed to the surface of said polishingpad; wherein said high velocity water carries away said particulatematter.
 13. The method of claim 12, wherein said supplying directs waterof a force effective to loosen diamond particles embedded in saidsurface of said polishing pad.